Leading Die Bonders Manufacturer MCM-die-bonder.com is a global leading supplier of production equipment for the back-end market, called die bonders, for the processing of the individual chips required by manufacturers of semiconductors. Datacon also develops and produces production equipment.
The 2200 apm Multi Chip MCM Die Bonder is the current industry standard based on Datacon's previous PPS 2200 MCM Die Bonder platform, a revolutionary modular system introduced in 1995.The Datacon 2200 apm provides users with extraordinary flexibility with minimum space requirements. Whatever connection technologies you choose (flip chip, die attach, or a combination of both) the conversion between different applications is done fast and simply. The 2200 apm was developed specifically for the demanding advanced packaging market. Advanced MCM Die Bonder by mcm-die-bonder.com |
