Flip Chip Bonder Datacon has concentrated on the advanced packaging market since 1986, focusing on die bonding and Flip chip technologies. Datacon leads the way in these markets, guaranteeing our customers a future-oriented, customized solution. Don't be content with anything else!
The flip chip market will experience extraordinary growth rates in the next several years - and Datacon is prepared for its take-off into high volume. With a large flip chip installed base, Datacon - the flip chip pioneer from the very beginning - proudly presents to you the powerful 8800 FC high-speed, high-accuracy platform for a wide range of flip chip processes.
The powerful 8800 FC platform is not just an upgrade - it's a complete new machine generation for high volume flip chip production. Based on Datacon's expertise gained from many years of experience, the 8800 FC platform will revolutionize the flip chip market. Flip Chip Die Bonding by flip-chip-die-attach.com |
